Electroplating Characteristics of Sn-Bi Microbumps for Low-Temperature Soldering

In this paper, the characteristics of eutectic Sn-Bi microsolder bumps fabricated by electroplating are investigated. The underbump metallization (UBM) layers on a Si chip consist of Al, Cu, Ni, and Au, sequentially from bottom to top. The desired Sn-Bi bump size has a diameter of 22 μm and pitch of...

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Veröffentlicht in:	IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2013-04, Vol.3 (4), p.566-573
Hauptverfasser:	Roh, Myong-Hoon, Jung, Jae Pil, Kim, Wonjoong
Format:	Artikel
Sprache:	eng
Schlagworte:	Bismuth compounds Current density Electric potential Electroplating eutectic Sn-Bi polarization curve Polarization curves solder bump
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