Equipment and Test Results of the Electronic Components to SEE in the Temperature Range

This paper presents SEE test facility as well as its opportunities of integrated microcircuit tests in the temperature range. The used method of heating and cooling of DUT was considered in vacuum chamber of test facility.

Bibliographische Detailangaben

Hauptverfasser:	Anashin, V. S., Kozyukov, A. E., Emeliyanov, V. V., Ozerov, A. I., Vatuev, A. S., Besetskiy, A. V., Skuratov, V. A., Bakerenkov, A. S., Belyakov, V. V.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Electronic components Heating Temperature distribution Temperature measurement Temperature sensors Test facilities
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