Quantitative investigation of the adhesion failure of Ti-based metal thin films on Si wafers

In this study, failure analysis was conducted to investigate the root cause of Ti/Ni/Ag film peeling from Si wafer surface. The adhesion strength of Ti/Ni/Ag film on Si was quantitatively measured by 4 Point Bending method (4PB), where a novel delamination initiation method was introduced to signifi...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Chen Shuting, Zhu Jie, Anyan, D., Hua Younan
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Adhesives Nickel Rough surfaces Silicon Surface roughness Surface treatment
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