TSV technology for 2.5D IC solution

TSV (Through Silicon Via) is the key enabling technology for 2.5D & 3D IC packaging solution. As the 2.5D interposer design pushing towards smaller & shorter via due to I/O density and electrical performance, the warpage of thinner interposer is therefore much more challenging in thin wafer...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Meng-Jen Wang, Chang-Ying Hung, Chin-Li Kao, Pao-Nan Lee, Chi-Han Chen, Chih-Pin Hung, Ho-Ming Tong
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Assembly Polymers Reliability Silicon Substrates Through-silicon vias
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