Poly/high-k/SiON gate stack and novel profile engineering dedicated for ultralow-voltage silicon-on-thin-BOX (SOTB) CMOS operation

We demonstrated Silicon on Thin Buried oxide (SOTB) CMOS especially designed for ultralow-voltage (ULV) operation down to 0.4 V for the first time. Utilizing i) dual-poly gate stack with high-k having quarter-gap work functions best for the ULV CMOS operation, and ii) a novel "local ground plan...

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Hauptverfasser: Yamamoto, Y., Makiyama, H., Tsunomura, T., Iwamatsu, T., Oda, H., Sugii, N., Yamaguchi, Y., Mizutani, T., Hiramoto, T.
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creator Yamamoto, Y.
Makiyama, H.
Tsunomura, T.
Iwamatsu, T.
Oda, H.
Sugii, N.
Yamaguchi, Y.
Mizutani, T.
Hiramoto, T.
description We demonstrated Silicon on Thin Buried oxide (SOTB) CMOS especially designed for ultralow-voltage (ULV) operation down to 0.4 V for the first time. Utilizing i) dual-poly gate stack with high-k having quarter-gap work functions best for the ULV CMOS operation, and ii) a novel "local ground plane (LGP)" structure that significantly improves short-channel effect (V th roll off) without increasing local variability unlike halo for bulk, low-leakage SRAM operation was demonstrated with adaptive-body-bias (ABB) scheme.
doi_str_mv 10.1109/VLSIT.2012.6242485
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subjects Hafnium
High K dielectric materials
Logic gates
Random access memory
Silicon
Transistors
Very large scale integration
title Poly/high-k/SiON gate stack and novel profile engineering dedicated for ultralow-voltage silicon-on-thin-BOX (SOTB) CMOS operation
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