Room-temperature microjoining using ultrasonic bonding of compliant bump

Ultrasonic bonding was applied to cone-shaped microbump made of Au on a Si chip to perform bonding at room temperature. Array of cone-shaped microbump having 10 μm in diameter and 20μm in pitch was formed on Si using photolithography and electroplating. The counter electrode was a planar electrode w...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Iwanabe, K., Shuto, T., Noda, K., Nakai, S., Asano, T.
Format:	Tagungsbericht
Sprache:	eng ; jpn
Schlagworte:	3DIC Acoustics Bonding chip-on-chip compliant bump cone-shaped bump Electrodes Gold Pressing Radiation detectors room temperature microjoining Temperature measurement ultrasonic bonding
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