EMI study of high-speed IC package based on pin map

With the ever-increasing of the speed of the integrated circuit (IC), more and more electromagnetic interference (EMI) problems have been introduced by the high-speed IC. In real engineering applications, the pin map is often employed for the high-speed IC package to reduce such EMI radiation. In th...

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Bibliographische Detailangaben
Hauptverfasser: Xuequan Yu, Yadong Bai, Yan Zhou, Wei Bai, Lin Yang, Junxin Min
Format: Tagungsbericht
Sprache:eng
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