Interconnect properties and multilayer bandpass filter design in LTCC substrates

The effects of a perforated ground plane on multilayer interconnect structures fabricated in low temperature cofired ceramic are examined. Simple transmission lines and coupled transmission lines have been designed and simulated. Results are presented to aid in the design of planar passive embedded...

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Bibliographische Detailangaben
Hauptverfasser: Raby, S.A., Cangellaris, A.C.
Format: Tagungsbericht
Sprache:eng
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