MSC-clustering and forward stepwise regression for virtual metrology in highly correlated input spaces

Increasingly semiconductor manufacturers are exploring opportunities for virtual metrology (VM) enabled process monitoring and control as a means of reducing non-value added metrology and achieving ever more demanding wafer fabrication tolerances. However, developing robust, reliable and interpretab...

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Bibliographische Detailangaben

Hauptverfasser:	Prakash, P., Schirru, A., Hung, P., McLoone, S.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Buildings clustering Metrology optical emission spectroscopy plasma etch processes Plasmas Process control regression Semiconductor device modeling Spectroscopy Stimulated emission Virtual metrology
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