Thermal calculation using a 3D-EM solver and thermal-electrical analogy
In this paper, a steady state thermal simulation approach is implemented, which makes use of a conventional electromagnetic simulator in order to take advantage of the existing software. To solve the problem, the thermal-electrical analogy will be taken into account, including conduction, convection...
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| creator | Nistal-Gonzalez, Ismael Bettray, Andreas Maulwurf, Kai |
| description | In this paper, a steady state thermal simulation approach is implemented, which makes use of a conventional electromagnetic simulator in order to take advantage of the existing software. To solve the problem, the thermal-electrical analogy will be taken into account, including conduction, convection and radiation. Empire XCcel™ along with a script implemented in Python have been used to simulate the built prototypes. The validation of the proposed method has been carried out with an infra-red camera. |
| doi_str_mv | 10.1109/EuCAP.2012.6206535 |
| format | Conference Proceeding |
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To solve the problem, the thermal-electrical analogy will be taken into account, including conduction, convection and radiation. Empire XCcel™ along with a script implemented in Python have been used to simulate the built prototypes. The validation of the proposed method has been carried out with an infra-red camera.</description><subject>conduction</subject><subject>convection</subject><subject>Electronic packaging thermal management</subject><subject>EM simulation</subject><subject>Heat sinks</subject><subject>Heating</subject><subject>radiation</subject><subject>Temperature measurement</subject><subject>Thermal analysis</subject><subject>Thermal conductivity</subject><subject>Thermal resistance</subject><subject>Thermal simulation</subject><subject>thermal-electrical analogy</subject><issn>2164-3342</issn><isbn>145770918X</isbn><isbn>9781457709180</isbn><isbn>1457709201</isbn><isbn>9781457709203</isbn><isbn>1457709198</isbn><isbn>9781457709197</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2012</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNo9kMtOwzAURI0AiVL6A7DxDzjc60diL6sQClIRLLJgVxnntgS5CcoDqX_fSK1YjeZoZhbD2D1CggjusRjz5UciAWWSSkiNMhfsFrXJMnATvfw3aD-v2ExiqoVSWt6wRd__AAA6A9amM7Yqv6nb-8iDj2GMfqjbho993ey45-pJFG-8b-Mfddw3FR9OYUGRwtDVU2fCPra7wx273vrY0-Ksc1Y-F2X-Itbvq9d8uRa1g0EQuOARVaokaBOc9OQCkcPMeqe32tngA4YqMxQUfYHSRksCUtZmJEOl5uzhNFsT0ea3q_e-O2zOH6gjcu5OBw</recordid><startdate>201203</startdate><enddate>201203</enddate><creator>Nistal-Gonzalez, Ismael</creator><creator>Bettray, Andreas</creator><creator>Maulwurf, Kai</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>201203</creationdate><title>Thermal calculation using a 3D-EM solver and thermal-electrical analogy</title><author>Nistal-Gonzalez, Ismael ; Bettray, Andreas ; Maulwurf, Kai</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i90t-e09ca113632045c92ae9cee9178a94f498cac1cd75ec3eb034542e0e3887e2cd3</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2012</creationdate><topic>conduction</topic><topic>convection</topic><topic>Electronic packaging thermal management</topic><topic>EM simulation</topic><topic>Heat sinks</topic><topic>Heating</topic><topic>radiation</topic><topic>Temperature measurement</topic><topic>Thermal analysis</topic><topic>Thermal conductivity</topic><topic>Thermal resistance</topic><topic>Thermal simulation</topic><topic>thermal-electrical analogy</topic><toplevel>online_resources</toplevel><creatorcontrib>Nistal-Gonzalez, Ismael</creatorcontrib><creatorcontrib>Bettray, Andreas</creatorcontrib><creatorcontrib>Maulwurf, Kai</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Nistal-Gonzalez, Ismael</au><au>Bettray, Andreas</au><au>Maulwurf, Kai</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Thermal calculation using a 3D-EM solver and thermal-electrical analogy</atitle><btitle>2012 6th European Conference on Antennas and Propagation (EUCAP)</btitle><stitle>EuCAP</stitle><date>2012-03</date><risdate>2012</risdate><spage>1</spage><epage>4</epage><pages>1-4</pages><issn>2164-3342</issn><isbn>145770918X</isbn><isbn>9781457709180</isbn><eisbn>1457709201</eisbn><eisbn>9781457709203</eisbn><eisbn>1457709198</eisbn><eisbn>9781457709197</eisbn><abstract>In this paper, a steady state thermal simulation approach is implemented, which makes use of a conventional electromagnetic simulator in order to take advantage of the existing software. To solve the problem, the thermal-electrical analogy will be taken into account, including conduction, convection and radiation. Empire XCcel™ along with a script implemented in Python have been used to simulate the built prototypes. The validation of the proposed method has been carried out with an infra-red camera.</abstract><pub>IEEE</pub><doi>10.1109/EuCAP.2012.6206535</doi><tpages>4</tpages></addata></record> |
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| identifier | ISSN: 2164-3342 |
| ispartof | 2012 6th European Conference on Antennas and Propagation (EUCAP), 2012, p.1-4 |
| issn | 2164-3342 |
| language | eng |
| recordid | cdi_ieee_primary_6206535 |
| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | conduction convection Electronic packaging thermal management EM simulation Heat sinks Heating radiation Temperature measurement Thermal analysis Thermal conductivity Thermal resistance Thermal simulation thermal-electrical analogy |
| title | Thermal calculation using a 3D-EM solver and thermal-electrical analogy |
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