Thermal resistance investigations on new leadframe-based LED packages and boards

In Solid State Lighting, thermal management is a key issue. Within the C-SSL consortium, we have developed an advanced leadframe based package to reduce the thermal resistance of the component. Numerical simulations have been implemented using Ansys ® software and thermal measurements have been carr...

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Bibliographische Detailangaben

Hauptverfasser:	Pardo, B., Gasse, A., Fargeix, A., Jakovenko, J., Werkhoven, R. J., Perpina, X., Van Weelden, T., Bancken, P.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Cooling Heating Lead Nonhomogeneous media RNA
Online-Zugang:	Volltext bestellen
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