Characterization and comparison of silicon nitride films deposited using two novel processes

Hydrogenated silicon nitride films (SiN x :H) deposited using a PECVD process enhance the performance of crystalline silicon solar cells by functioning as an efficient anti-reflection coating and passivating layer. In this paper, we compared two novel SiN x :H deposition processes using two differen...

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Hauptverfasser: Sharma, V., Bailey, A., Dauksher, B., Tracy, C., Bowden, S., O'Brien, B.
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Bailey, A.
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Tracy, C.
Bowden, S.
O'Brien, B.
description Hydrogenated silicon nitride films (SiN x :H) deposited using a PECVD process enhance the performance of crystalline silicon solar cells by functioning as an efficient anti-reflection coating and passivating layer. In this paper, we compared two novel SiN x :H deposition processes using two different PECVD tools - one non-traditional in process regime, and the other non-traditional in type, to determine their suitability to solar cell fabrication. The parameter space was explored by employing a design of experiment methodology followed by material characterization using VASE, reflectance, FTIR and RBS/ERD. The thickness and reflectance of Si-rich films changed dramatically after annealing. Further, FTIR results showed that the Si-H bond peak present at 2160 cm -1 in such films disappeared after a typical Al firing step. Therefore, the optimized films were deposited with a lower SiH 4 /NH 3 ratio to minimize the changes in the film properties after annealing.
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subjects Firing
Photovoltaic cells
Plasma temperature
Reflectivity
Refractive index
Silicon
title Characterization and comparison of silicon nitride films deposited using two novel processes
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