A new method for rapid measurement of orientations and sizes of grains in multicrystalline silicon wafers

We describe a new technique for rapid measurement of orientations and sizes of various grains in a multicrystalline silicon (mc-Si) wafer. The wafer is texture etched to expose (111) faces nearest to each surface. Because grains of different orientations result in uniquely different texture shapes,...

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Bibliographische Detailangaben
Hauptverfasser:	Sopori, Bhushan, Guhabiswas, D., Rupnowski, P., Shet, S., Devayajanam, S., Moutinho, H.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Crystals DISTRIBUTION GRAIN BOUNDARIES GRAIN ORIENTATION grain orientations MATERIALS SCIENCE ORIENTATION rapid measurement Reflection Reflectivity Shape SILICON silicon wafers SOLAR ENERGY Surface texture Surface treatment TEXTURE
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