Development of thermal compression bonding with Non Conductive Paste for 3DIC fine pitch copper pillar bump interconnections

High density interconnection is a key technology to realize the miniaturization trend in Integrated Circuit (IC) industry, and to reduce power consumption for next generation mobile devices. In advanced three-dimensional (3D) package, fine pitch pillar bump is deployed not only to fulfill ever-growi...

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Bibliographische Detailangaben

Hauptverfasser:	Chien-Feng Chan, Wen-Tsung Tseng, Huei-Nuan Huang, Pin Huang, Mu-Hsuan Chan, Chun-Tang Lin, Liu, M., Chi-Hsin Chiu, Chiu, S., Ma, M.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Bonding Delamination Legged locomotion Materials Materials reliability Shape
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