Self-consistent electro-thermo-mechanical analysis of AlN passivation effect on AlGaN/GaN HEMTs
In this article, the effect of AlN materials as passivation over AlGaN layer on AlGaN/GaN HEMTs performance was investigated firstly using electro-thermo-mechanical coupled methodology by both TCAD simulation and analytic calculation. It suggested that AlN passivation layer over AlGaN layer effectiv...
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creator | Prabowo, B. A. Anumeha Prakash, A. Kumar, R. Sheu, G. Jung-Ruey Tsai Shao-Ming Yang |
description | In this article, the effect of AlN materials as passivation over AlGaN layer on AlGaN/GaN HEMTs performance was investigated firstly using electro-thermo-mechanical coupled methodology by both TCAD simulation and analytic calculation. It suggested that AlN passivation layer over AlGaN layer effectively spread the surface heat from the channel resulting in reduction of the lattice temperature and enhances the mechanical properties. The drain current in the AlN-passivated device significantly increases about 30% higher than that in un passivated AlN layer device which is consistent with previous experimental data and demonstrates that the current collapse can be suppressed by dielectric AlN passivation process. |
doi_str_mv | 10.1109/TENCON.2011.6129029 |
format | Conference Proceeding |
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A. ; Anumeha ; Prakash, A. ; Kumar, R. ; Sheu, G. ; Jung-Ruey Tsai ; Shao-Ming Yang</creator><creatorcontrib>Prabowo, B. A. ; Anumeha ; Prakash, A. ; Kumar, R. ; Sheu, G. ; Jung-Ruey Tsai ; Shao-Ming Yang</creatorcontrib><description>In this article, the effect of AlN materials as passivation over AlGaN layer on AlGaN/GaN HEMTs performance was investigated firstly using electro-thermo-mechanical coupled methodology by both TCAD simulation and analytic calculation. It suggested that AlN passivation layer over AlGaN layer effectively spread the surface heat from the channel resulting in reduction of the lattice temperature and enhances the mechanical properties. The drain current in the AlN-passivated device significantly increases about 30% higher than that in un passivated AlN layer device which is consistent with previous experimental data and demonstrates that the current collapse can be suppressed by dielectric AlN passivation process.</description><identifier>ISSN: 2159-3442</identifier><identifier>ISBN: 9781457702563</identifier><identifier>ISBN: 1457702568</identifier><identifier>EISSN: 2159-3450</identifier><identifier>EISBN: 9781457702556</identifier><identifier>EISBN: 145770255X</identifier><identifier>EISBN: 9781457702549</identifier><identifier>EISBN: 1457702541</identifier><identifier>DOI: 10.1109/TENCON.2011.6129029</identifier><language>eng</language><publisher>IEEE</publisher><subject>AlGaN/GaN ; AlN passivation ; Aluminum gallium nitride ; electro-thermo-mechanical ; Gallium nitride ; HEMT ; HEMTs ; Lattices ; MODFETs ; Passivation ; reliability ; Stress</subject><ispartof>TENCON 2011 - 2011 IEEE Region 10 Conference, 2011, p.1356-1360</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/6129029$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,780,784,789,790,2058,27925,54920</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/6129029$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Prabowo, B. 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The drain current in the AlN-passivated device significantly increases about 30% higher than that in un passivated AlN layer device which is consistent with previous experimental data and demonstrates that the current collapse can be suppressed by dielectric AlN passivation process.</description><subject>AlGaN/GaN</subject><subject>AlN passivation</subject><subject>Aluminum gallium nitride</subject><subject>electro-thermo-mechanical</subject><subject>Gallium nitride</subject><subject>HEMT</subject><subject>HEMTs</subject><subject>Lattices</subject><subject>MODFETs</subject><subject>Passivation</subject><subject>reliability</subject><subject>Stress</subject><issn>2159-3442</issn><issn>2159-3450</issn><isbn>9781457702563</isbn><isbn>1457702568</isbn><isbn>9781457702556</isbn><isbn>145770255X</isbn><isbn>9781457702549</isbn><isbn>1457702541</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2011</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNpVkN1qAjEQhdM_qFifwJu8QDSZ_G0uRawW7HpRey3ZdYIpcVc2S8G375aWQg8M58A3MxeHkKngMyG4m-9X5XJXzoALMTMCHAd3QybOFkJpazlobW7JCIR2TCrN7_4xI-__mIJHMsn5gw8yvFCCj8jhDVNgddvkmHtseooJ675rWX_C7tyyM9Yn38TaJ-obn67DGm0DXaSSXnzO8dP3sW0ohjCc0SEt0tqX82HoZvW6z0_kIfiUcfLrY_L-vNovN2y7W78sF1sWhdU9k9IqcBpMQOussJWCcDRQOa1r76EogtXSeFfDdw3OoVaiqPSxMBU4pYIck-nP34iIh0sXz767Hn7rkl-vhVi4</recordid><startdate>201111</startdate><enddate>201111</enddate><creator>Prabowo, B. A.</creator><creator>Anumeha</creator><creator>Prakash, A.</creator><creator>Kumar, R.</creator><creator>Sheu, G.</creator><creator>Jung-Ruey Tsai</creator><creator>Shao-Ming Yang</creator><general>IEEE</general><scope>6IE</scope><scope>6IH</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIO</scope></search><sort><creationdate>201111</creationdate><title>Self-consistent electro-thermo-mechanical analysis of AlN passivation effect on AlGaN/GaN HEMTs</title><author>Prabowo, B. A. ; Anumeha ; Prakash, A. ; Kumar, R. ; Sheu, G. ; Jung-Ruey Tsai ; Shao-Ming Yang</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i175t-337429526fe79717b42fd62b955caa288f7536a9c2201199e5418b5d86b2944f3</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2011</creationdate><topic>AlGaN/GaN</topic><topic>AlN passivation</topic><topic>Aluminum gallium nitride</topic><topic>electro-thermo-mechanical</topic><topic>Gallium nitride</topic><topic>HEMT</topic><topic>HEMTs</topic><topic>Lattices</topic><topic>MODFETs</topic><topic>Passivation</topic><topic>reliability</topic><topic>Stress</topic><toplevel>online_resources</toplevel><creatorcontrib>Prabowo, B. A.</creatorcontrib><creatorcontrib>Anumeha</creatorcontrib><creatorcontrib>Prakash, A.</creatorcontrib><creatorcontrib>Kumar, R.</creatorcontrib><creatorcontrib>Sheu, G.</creatorcontrib><creatorcontrib>Jung-Ruey Tsai</creatorcontrib><creatorcontrib>Shao-Ming Yang</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan (POP) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP) 1998-present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Prabowo, B. A.</au><au>Anumeha</au><au>Prakash, A.</au><au>Kumar, R.</au><au>Sheu, G.</au><au>Jung-Ruey Tsai</au><au>Shao-Ming Yang</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Self-consistent electro-thermo-mechanical analysis of AlN passivation effect on AlGaN/GaN HEMTs</atitle><btitle>TENCON 2011 - 2011 IEEE Region 10 Conference</btitle><stitle>TENCON</stitle><date>2011-11</date><risdate>2011</risdate><spage>1356</spage><epage>1360</epage><pages>1356-1360</pages><issn>2159-3442</issn><eissn>2159-3450</eissn><isbn>9781457702563</isbn><isbn>1457702568</isbn><eisbn>9781457702556</eisbn><eisbn>145770255X</eisbn><eisbn>9781457702549</eisbn><eisbn>1457702541</eisbn><abstract>In this article, the effect of AlN materials as passivation over AlGaN layer on AlGaN/GaN HEMTs performance was investigated firstly using electro-thermo-mechanical coupled methodology by both TCAD simulation and analytic calculation. It suggested that AlN passivation layer over AlGaN layer effectively spread the surface heat from the channel resulting in reduction of the lattice temperature and enhances the mechanical properties. The drain current in the AlN-passivated device significantly increases about 30% higher than that in un passivated AlN layer device which is consistent with previous experimental data and demonstrates that the current collapse can be suppressed by dielectric AlN passivation process.</abstract><pub>IEEE</pub><doi>10.1109/TENCON.2011.6129029</doi><tpages>5</tpages></addata></record> |
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subjects | AlGaN/GaN AlN passivation Aluminum gallium nitride electro-thermo-mechanical Gallium nitride HEMT HEMTs Lattices MODFETs Passivation reliability Stress |
title | Self-consistent electro-thermo-mechanical analysis of AlN passivation effect on AlGaN/GaN HEMTs |
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