Outsource bond pad reliability methodology setup for foundry process changes
Wire Bond Shear (WBS) test is a method for evaluating the strength of a ball bond, to complement wire pull test. In foundry, wafer-level (WLR) WBS provides a quick way to demonstrate the integrity of metal bond pad, backend scheme as well as bond or via design. This is a big challenge for WLR WBS ou...
Gespeichert in:
1. Verfasser: | |
---|---|
Format: | Tagungsbericht |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | 699 |
---|---|
container_issue | |
container_start_page | 696 |
container_title | |
container_volume | |
creator | Ng, Hong Seng |
description | Wire Bond Shear (WBS) test is a method for evaluating the strength of a ball bond, to complement wire pull test. In foundry, wafer-level (WLR) WBS provides a quick way to demonstrate the integrity of metal bond pad, backend scheme as well as bond or via design. This is a big challenge for WLR WBS outsourcing as many of the factors affecting shear strength lying on the wire bonding parameters and shear test setup. This paper presents the outsourcing experiences of WBS tests and good shear strength was achieved from the outsource laboratory. |
doi_str_mv | 10.1109/ISIEA.2011.6108805 |
format | Conference Proceeding |
fullrecord | <record><control><sourceid>ieee_6IE</sourceid><recordid>TN_cdi_ieee_primary_6108805</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>6108805</ieee_id><sourcerecordid>6108805</sourcerecordid><originalsourceid>FETCH-LOGICAL-i90t-18ee0659cc562c7441a3b8cd49a1fed5b362516075c67c6cdf0275e5ec24476f3</originalsourceid><addsrcrecordid>eNpFj8tqwzAURFVKoW2aH2g3-gG7urIe9jKEtDUYsmj2QZauExXHMpK98N830EAHhsNsDgwhr8ByAFa919_1bpNzBpArYGXJ5B15BiG1BgFK3_-Psngk65R-2DVKVZyrJ9Ls5ymFOVqkbRgcHY2jEXtvWt_7aaEXnM7BhT6cFppwmkfahXjtPLi40DEGiylRezbDCdMLeehMn3B944ocPnaH7VfW7D_r7abJfMWmDEpEpmRlrVTcaiHAFG1pnagMdOhkWyguQTEtrdJWWdcxriVKtFwIrbpiRd7-tB4Rj2P0FxOX4-188QvR0k7t</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>Outsource bond pad reliability methodology setup for foundry process changes</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Ng, Hong Seng</creator><creatorcontrib>Ng, Hong Seng</creatorcontrib><description>Wire Bond Shear (WBS) test is a method for evaluating the strength of a ball bond, to complement wire pull test. In foundry, wafer-level (WLR) WBS provides a quick way to demonstrate the integrity of metal bond pad, backend scheme as well as bond or via design. This is a big challenge for WLR WBS outsourcing as many of the factors affecting shear strength lying on the wire bonding parameters and shear test setup. This paper presents the outsourcing experiences of WBS tests and good shear strength was achieved from the outsource laboratory.</description><identifier>ISBN: 1457714183</identifier><identifier>ISBN: 9781457714184</identifier><identifier>EISBN: 1457714167</identifier><identifier>EISBN: 9781457714177</identifier><identifier>EISBN: 1457714175</identifier><identifier>EISBN: 9781457714160</identifier><identifier>DOI: 10.1109/ISIEA.2011.6108805</identifier><language>eng</language><publisher>IEEE</publisher><subject>Bonding ; Force ; Foundries ; Histograms ; Outsourcing ; Reliability ; Wire Bond Shear ; Wires</subject><ispartof>2011 IEEE Symposium on Industrial Electronics and Applications, 2011, p.696-699</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/6108805$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,776,780,785,786,2051,27904,54898</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/6108805$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Ng, Hong Seng</creatorcontrib><title>Outsource bond pad reliability methodology setup for foundry process changes</title><title>2011 IEEE Symposium on Industrial Electronics and Applications</title><addtitle>ISIEA</addtitle><description>Wire Bond Shear (WBS) test is a method for evaluating the strength of a ball bond, to complement wire pull test. In foundry, wafer-level (WLR) WBS provides a quick way to demonstrate the integrity of metal bond pad, backend scheme as well as bond or via design. This is a big challenge for WLR WBS outsourcing as many of the factors affecting shear strength lying on the wire bonding parameters and shear test setup. This paper presents the outsourcing experiences of WBS tests and good shear strength was achieved from the outsource laboratory.</description><subject>Bonding</subject><subject>Force</subject><subject>Foundries</subject><subject>Histograms</subject><subject>Outsourcing</subject><subject>Reliability</subject><subject>Wire Bond Shear</subject><subject>Wires</subject><isbn>1457714183</isbn><isbn>9781457714184</isbn><isbn>1457714167</isbn><isbn>9781457714177</isbn><isbn>1457714175</isbn><isbn>9781457714160</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2011</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNpFj8tqwzAURFVKoW2aH2g3-gG7urIe9jKEtDUYsmj2QZauExXHMpK98N830EAHhsNsDgwhr8ByAFa919_1bpNzBpArYGXJ5B15BiG1BgFK3_-Psngk65R-2DVKVZyrJ9Ls5ymFOVqkbRgcHY2jEXtvWt_7aaEXnM7BhT6cFppwmkfahXjtPLi40DEGiylRezbDCdMLeehMn3B944ocPnaH7VfW7D_r7abJfMWmDEpEpmRlrVTcaiHAFG1pnagMdOhkWyguQTEtrdJWWdcxriVKtFwIrbpiRd7-tB4Rj2P0FxOX4-188QvR0k7t</recordid><startdate>201109</startdate><enddate>201109</enddate><creator>Ng, Hong Seng</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>201109</creationdate><title>Outsource bond pad reliability methodology setup for foundry process changes</title><author>Ng, Hong Seng</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i90t-18ee0659cc562c7441a3b8cd49a1fed5b362516075c67c6cdf0275e5ec24476f3</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2011</creationdate><topic>Bonding</topic><topic>Force</topic><topic>Foundries</topic><topic>Histograms</topic><topic>Outsourcing</topic><topic>Reliability</topic><topic>Wire Bond Shear</topic><topic>Wires</topic><toplevel>online_resources</toplevel><creatorcontrib>Ng, Hong Seng</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Ng, Hong Seng</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Outsource bond pad reliability methodology setup for foundry process changes</atitle><btitle>2011 IEEE Symposium on Industrial Electronics and Applications</btitle><stitle>ISIEA</stitle><date>2011-09</date><risdate>2011</risdate><spage>696</spage><epage>699</epage><pages>696-699</pages><isbn>1457714183</isbn><isbn>9781457714184</isbn><eisbn>1457714167</eisbn><eisbn>9781457714177</eisbn><eisbn>1457714175</eisbn><eisbn>9781457714160</eisbn><abstract>Wire Bond Shear (WBS) test is a method for evaluating the strength of a ball bond, to complement wire pull test. In foundry, wafer-level (WLR) WBS provides a quick way to demonstrate the integrity of metal bond pad, backend scheme as well as bond or via design. This is a big challenge for WLR WBS outsourcing as many of the factors affecting shear strength lying on the wire bonding parameters and shear test setup. This paper presents the outsourcing experiences of WBS tests and good shear strength was achieved from the outsource laboratory.</abstract><pub>IEEE</pub><doi>10.1109/ISIEA.2011.6108805</doi><tpages>4</tpages></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | ISBN: 1457714183 |
ispartof | 2011 IEEE Symposium on Industrial Electronics and Applications, 2011, p.696-699 |
issn | |
language | eng |
recordid | cdi_ieee_primary_6108805 |
source | IEEE Electronic Library (IEL) Conference Proceedings |
subjects | Bonding Force Foundries Histograms Outsourcing Reliability Wire Bond Shear Wires |
title | Outsource bond pad reliability methodology setup for foundry process changes |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-27T03%3A18%3A53IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=Outsource%20bond%20pad%20reliability%20methodology%20setup%20for%20foundry%20process%20changes&rft.btitle=2011%20IEEE%20Symposium%20on%20Industrial%20Electronics%20and%20Applications&rft.au=Ng,%20Hong%20Seng&rft.date=2011-09&rft.spage=696&rft.epage=699&rft.pages=696-699&rft.isbn=1457714183&rft.isbn_list=9781457714184&rft_id=info:doi/10.1109/ISIEA.2011.6108805&rft_dat=%3Cieee_6IE%3E6108805%3C/ieee_6IE%3E%3Curl%3E%3C/url%3E&rft.eisbn=1457714167&rft.eisbn_list=9781457714177&rft.eisbn_list=1457714175&rft.eisbn_list=9781457714160&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=6108805&rfr_iscdi=true |