Characterization of microstructure of lead free solder by different image processing algorithms

The microstructure of lead free solder joints was investigated by three different image processing techniques. Tin (Sn) was extracted from the cross sectioned samples by selective etching technique. Samples were generated by laser soldering. The cellular network of the Sn-Ag intermetallic compound r...

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Bibliographische Detailangaben

Hauptverfasser:	Hurtony, T., Sinkovics, B., Gordon, P.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	image processing Image segmentation intermetallic compound Microstructure Shape Soldering Surface topography Tin
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