Compact LTCC module for WLAN RF front-end
In this paper, a low-temperature co-fired ceramic (LTCC) module for Wireless Local Area Network (WLAN) RF front-end is proposed. The module integrates an embedded band pass filter, an embedded lumped element Wilkinson power divider, and embedded LTCC inductors and capacitors, in a single LTCC packag...
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creator | Li-Zheng Zhu Xu-Bo Wei Peng Wang Song Ma Zhi-Yi Zeng Bang-Chao Yang |
description | In this paper, a low-temperature co-fired ceramic (LTCC) module for Wireless Local Area Network (WLAN) RF front-end is proposed. The module integrates an embedded band pass filter, an embedded lumped element Wilkinson power divider, and embedded LTCC inductors and capacitors, in a single LTCC package. The circuit is separated into low-frequency circuit part and high frequency circuit part. By integrating these miniature passive component designs, using the three-dimensional multichip module multichip module (3D-MCM) technique, the proposed module features a compact size of 20mm×20mm×5mm. The measurement results show that the application meets the current electrical specification requirements of the wireless communication system compatible with IEEE802.11b/g. |
doi_str_mv | 10.1109/ICCPS.2011.6092238 |
format | Conference Proceeding |
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The measurement results show that the application meets the current electrical specification requirements of the wireless communication system compatible with IEEE802.11b/g.</description><subject>Band pass filters</subject><subject>Inductors</subject><subject>Microwave amplifiers</subject><subject>Power amplifiers</subject><subject>Power dividers</subject><subject>Substrates</subject><subject>Wireless LAN</subject><isbn>9781457706028</isbn><isbn>1457706024</isbn><isbn>9781457706011</isbn><isbn>1457706008</isbn><isbn>9781457706035</isbn><isbn>1457706032</isbn><isbn>9781457706004</isbn><isbn>1457706016</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2011</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNpVj09Lw0AUxFdEUGq-gF726iHx7Z9u3h7LYm0haKkBj2V38xYiTVOSePDbG7AX5zLM7zDDMPYgoBAC7PPWud1HIUGIwoCVUuEVy2yJQi_LEszMr_9libcsG8cvmGUMotZ37Mn13dnHiVe1c7zrm-8j8dQP_LNavfH9mqehP005nZp7dpP8caTs4gtWr19qt8mr99etW1V5a2HK07yEPihvrQ7oUUiBBMoH0I0KpomgdVjKkmwiQJNIkjVJaRFjJNUYtWCPf7UtER3OQ9v54edw-ad-AeRtQSE</recordid><startdate>201110</startdate><enddate>201110</enddate><creator>Li-Zheng Zhu</creator><creator>Xu-Bo Wei</creator><creator>Peng Wang</creator><creator>Song Ma</creator><creator>Zhi-Yi Zeng</creator><creator>Bang-Chao Yang</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>201110</creationdate><title>Compact LTCC module for WLAN RF front-end</title><author>Li-Zheng Zhu ; Xu-Bo Wei ; Peng Wang ; Song Ma ; Zhi-Yi Zeng ; Bang-Chao Yang</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i90t-f7708ab3a994b8a81218e03ab04d3b6dc044b527e9fe086fe2e96f341ccce3d63</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2011</creationdate><topic>Band pass filters</topic><topic>Inductors</topic><topic>Microwave amplifiers</topic><topic>Power amplifiers</topic><topic>Power dividers</topic><topic>Substrates</topic><topic>Wireless LAN</topic><toplevel>online_resources</toplevel><creatorcontrib>Li-Zheng Zhu</creatorcontrib><creatorcontrib>Xu-Bo Wei</creatorcontrib><creatorcontrib>Peng Wang</creatorcontrib><creatorcontrib>Song Ma</creatorcontrib><creatorcontrib>Zhi-Yi Zeng</creatorcontrib><creatorcontrib>Bang-Chao Yang</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE/IET Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Li-Zheng Zhu</au><au>Xu-Bo Wei</au><au>Peng Wang</au><au>Song Ma</au><au>Zhi-Yi Zeng</au><au>Bang-Chao Yang</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Compact LTCC module for WLAN RF front-end</atitle><btitle>2011 International Conference on Computational Problem-Solving (ICCP)</btitle><stitle>ICCPS</stitle><date>2011-10</date><risdate>2011</risdate><spage>387</spage><epage>389</epage><pages>387-389</pages><isbn>9781457706028</isbn><isbn>1457706024</isbn><eisbn>9781457706011</eisbn><eisbn>1457706008</eisbn><eisbn>9781457706035</eisbn><eisbn>1457706032</eisbn><eisbn>9781457706004</eisbn><eisbn>1457706016</eisbn><abstract>In this paper, a low-temperature co-fired ceramic (LTCC) module for Wireless Local Area Network (WLAN) RF front-end is proposed. The module integrates an embedded band pass filter, an embedded lumped element Wilkinson power divider, and embedded LTCC inductors and capacitors, in a single LTCC package. The circuit is separated into low-frequency circuit part and high frequency circuit part. By integrating these miniature passive component designs, using the three-dimensional multichip module multichip module (3D-MCM) technique, the proposed module features a compact size of 20mm×20mm×5mm. The measurement results show that the application meets the current electrical specification requirements of the wireless communication system compatible with IEEE802.11b/g.</abstract><pub>IEEE</pub><doi>10.1109/ICCPS.2011.6092238</doi><tpages>3</tpages></addata></record> |
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ispartof | 2011 International Conference on Computational Problem-Solving (ICCP), 2011, p.387-389 |
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language | eng |
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source | IEEE Electronic Library (IEL) Conference Proceedings |
subjects | Band pass filters Inductors Microwave amplifiers Power amplifiers Power dividers Substrates Wireless LAN |
title | Compact LTCC module for WLAN RF front-end |
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