Comparative study of the effects of coalesced and distributed solder die attach voids on thermal resistance of packaged semiconductor device

Solder thermal interface materials are often used in power semiconductors to enhance heat dissipation from silicon die to the heat spreader. Nonetheless, the presence of voids in the die bond layer impedes heat flow and thus increases the chip junction temperature. Such voids which form easily in th...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Otiaba, K. C., Bhatti, R. S., Ekere, N. N., Ekpu, M., Adeyemi, J.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Electronic packaging thermal management Materials Resistance heating Solder die attach Thermal conductivity Thermal resistance voids and thermal resistance
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!