Improvement of the second bond strength in copper wire bonding on pre-plated leadframe

Due to the low cost and high mechanical and electrical properties of the copper wire as well as the environmental friendly pre-plated frame (PPF), copper wire bonding on PPF has been considered the most promising candidate to replace the gold wire bonding in actual volume production in the coming ye...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Bing An, Lan Ding, Techun Wang, Tailieh Lu, Liangquan Sun, Yiping Wu
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Bonding Copper Gold Heat treatment Lead Reliability Wires
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