The evolution of interfacial microstructure of Sn3.5Ag solder bump with Cu under-bump metallization
Low cost electrodeposited Sn3.5Ag solder bumps fabrication technology was developed for three-dimensional packaging applications. Effect of reflow time on interfacial reaction of electroplated Sn3.5Ag solder bumps with Cu under-bump metallization (UBM) was investigated. The microstructure of eutecti...
Gespeichert in:
| Hauptverfasser: | , , , |
|---|---|
| Format: | Tagungsbericht |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | 5 |
|---|---|
| container_issue | |
| container_start_page | 1 |
| container_title | |
| container_volume | |
| creator | Jinglin Bi Anmin Hu Ming Li Dali Mao |
| description | Low cost electrodeposited Sn3.5Ag solder bumps fabrication technology was developed for three-dimensional packaging applications. Effect of reflow time on interfacial reaction of electroplated Sn3.5Ag solder bumps with Cu under-bump metallization (UBM) was investigated. The microstructure of eutectic Sn3.5Ag is composed of β-Sn phase and Ag 3 Sn IMCs in the solder region. At the interface between solder and Cu, scallop-like Cu-Sn IMCs were formed toward solder region and were identified as Cu 6 Sn 5 IMCs by compositional measurement of EDX. XRD measurement identified that Cu 6 Sn 5 and Ag 3 Sn formed after reflowing for lmin, and as the reflow time extended the quantity of Ag 3 Sn almost remained the same while the quantity of Cu 6 Sn 5 increased. No Cu 3 Sn was detected, even after reflowing for 20min. EDX analysis was consistent with the XRD result. |
| doi_str_mv | 10.1109/ICEPT.2011.6066855 |
| format | Conference Proceeding |
| fullrecord | <record><control><sourceid>ieee_6IE</sourceid><recordid>TN_cdi_ieee_primary_6066855</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>6066855</ieee_id><sourcerecordid>6066855</sourcerecordid><originalsourceid>FETCH-LOGICAL-i90t-55c4fcfa0e3cf92a455e4139161b30b4026efd5f1ce6fd68f7759ec28bff0d993</originalsourceid><addsrcrecordid>eNotkN9KwzAYxSMiqLMvoDd5gdYvbZM0l6NMNxgo2PuRpl9cpH9Gmij69G66c3M4vwPn4hByzyBjDNTjpl69NlkOjGUChKg4vyCJkhUruZRMCiUvye05SIBrkszzBxwlhMol3BDT7JHi59TH4KaRTpa6MaC32jjd08EZP83BRxOix1P7NhYZX77Teeo79LSNw4F-ubCndaRxPKL0Dw0YdN-7H31avSNXVvczJmdfkOZp1dTrdPvyvKmX29QpCCnnprTGasDCWJXrknMsWaGYYG0BbQm5QNtxywwK24nKSskVmrxqrYVOqWJBHv5nHSLuDt4N2n_vzrcUv-ixWCY</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>The evolution of interfacial microstructure of Sn3.5Ag solder bump with Cu under-bump metallization</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Jinglin Bi ; Anmin Hu ; Ming Li ; Dali Mao</creator><creatorcontrib>Jinglin Bi ; Anmin Hu ; Ming Li ; Dali Mao</creatorcontrib><description>Low cost electrodeposited Sn3.5Ag solder bumps fabrication technology was developed for three-dimensional packaging applications. Effect of reflow time on interfacial reaction of electroplated Sn3.5Ag solder bumps with Cu under-bump metallization (UBM) was investigated. The microstructure of eutectic Sn3.5Ag is composed of β-Sn phase and Ag 3 Sn IMCs in the solder region. At the interface between solder and Cu, scallop-like Cu-Sn IMCs were formed toward solder region and were identified as Cu 6 Sn 5 IMCs by compositional measurement of EDX. XRD measurement identified that Cu 6 Sn 5 and Ag 3 Sn formed after reflowing for lmin, and as the reflow time extended the quantity of Ag 3 Sn almost remained the same while the quantity of Cu 6 Sn 5 increased. No Cu 3 Sn was detected, even after reflowing for 20min. EDX analysis was consistent with the XRD result.</description><identifier>ISBN: 1457717700</identifier><identifier>ISBN: 9781457717703</identifier><identifier>EISBN: 9781457717697</identifier><identifier>EISBN: 1457717697</identifier><identifier>EISBN: 1457717689</identifier><identifier>EISBN: 9781457717680</identifier><identifier>DOI: 10.1109/ICEPT.2011.6066855</identifier><language>eng</language><publisher>IEEE</publisher><subject>Copper ; Metallization ; Microstructure ; Packaging ; Silver ; Tin ; X-ray scattering</subject><ispartof>2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, 2011, p.1-5</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/6066855$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,780,784,789,790,2058,27925,54920</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/6066855$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Jinglin Bi</creatorcontrib><creatorcontrib>Anmin Hu</creatorcontrib><creatorcontrib>Ming Li</creatorcontrib><creatorcontrib>Dali Mao</creatorcontrib><title>The evolution of interfacial microstructure of Sn3.5Ag solder bump with Cu under-bump metallization</title><title>2011 12th International Conference on Electronic Packaging Technology and High Density Packaging</title><addtitle>ICEPT</addtitle><description>Low cost electrodeposited Sn3.5Ag solder bumps fabrication technology was developed for three-dimensional packaging applications. Effect of reflow time on interfacial reaction of electroplated Sn3.5Ag solder bumps with Cu under-bump metallization (UBM) was investigated. The microstructure of eutectic Sn3.5Ag is composed of β-Sn phase and Ag 3 Sn IMCs in the solder region. At the interface between solder and Cu, scallop-like Cu-Sn IMCs were formed toward solder region and were identified as Cu 6 Sn 5 IMCs by compositional measurement of EDX. XRD measurement identified that Cu 6 Sn 5 and Ag 3 Sn formed after reflowing for lmin, and as the reflow time extended the quantity of Ag 3 Sn almost remained the same while the quantity of Cu 6 Sn 5 increased. No Cu 3 Sn was detected, even after reflowing for 20min. EDX analysis was consistent with the XRD result.</description><subject>Copper</subject><subject>Metallization</subject><subject>Microstructure</subject><subject>Packaging</subject><subject>Silver</subject><subject>Tin</subject><subject>X-ray scattering</subject><isbn>1457717700</isbn><isbn>9781457717703</isbn><isbn>9781457717697</isbn><isbn>1457717697</isbn><isbn>1457717689</isbn><isbn>9781457717680</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2011</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNotkN9KwzAYxSMiqLMvoDd5gdYvbZM0l6NMNxgo2PuRpl9cpH9Gmij69G66c3M4vwPn4hByzyBjDNTjpl69NlkOjGUChKg4vyCJkhUruZRMCiUvye05SIBrkszzBxwlhMol3BDT7JHi59TH4KaRTpa6MaC32jjd08EZP83BRxOix1P7NhYZX77Teeo79LSNw4F-ubCndaRxPKL0Dw0YdN-7H31avSNXVvczJmdfkOZp1dTrdPvyvKmX29QpCCnnprTGasDCWJXrknMsWaGYYG0BbQm5QNtxywwK24nKSskVmrxqrYVOqWJBHv5nHSLuDt4N2n_vzrcUv-ixWCY</recordid><startdate>201108</startdate><enddate>201108</enddate><creator>Jinglin Bi</creator><creator>Anmin Hu</creator><creator>Ming Li</creator><creator>Dali Mao</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>201108</creationdate><title>The evolution of interfacial microstructure of Sn3.5Ag solder bump with Cu under-bump metallization</title><author>Jinglin Bi ; Anmin Hu ; Ming Li ; Dali Mao</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i90t-55c4fcfa0e3cf92a455e4139161b30b4026efd5f1ce6fd68f7759ec28bff0d993</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2011</creationdate><topic>Copper</topic><topic>Metallization</topic><topic>Microstructure</topic><topic>Packaging</topic><topic>Silver</topic><topic>Tin</topic><topic>X-ray scattering</topic><toplevel>online_resources</toplevel><creatorcontrib>Jinglin Bi</creatorcontrib><creatorcontrib>Anmin Hu</creatorcontrib><creatorcontrib>Ming Li</creatorcontrib><creatorcontrib>Dali Mao</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Jinglin Bi</au><au>Anmin Hu</au><au>Ming Li</au><au>Dali Mao</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>The evolution of interfacial microstructure of Sn3.5Ag solder bump with Cu under-bump metallization</atitle><btitle>2011 12th International Conference on Electronic Packaging Technology and High Density Packaging</btitle><stitle>ICEPT</stitle><date>2011-08</date><risdate>2011</risdate><spage>1</spage><epage>5</epage><pages>1-5</pages><isbn>1457717700</isbn><isbn>9781457717703</isbn><eisbn>9781457717697</eisbn><eisbn>1457717697</eisbn><eisbn>1457717689</eisbn><eisbn>9781457717680</eisbn><abstract>Low cost electrodeposited Sn3.5Ag solder bumps fabrication technology was developed for three-dimensional packaging applications. Effect of reflow time on interfacial reaction of electroplated Sn3.5Ag solder bumps with Cu under-bump metallization (UBM) was investigated. The microstructure of eutectic Sn3.5Ag is composed of β-Sn phase and Ag 3 Sn IMCs in the solder region. At the interface between solder and Cu, scallop-like Cu-Sn IMCs were formed toward solder region and were identified as Cu 6 Sn 5 IMCs by compositional measurement of EDX. XRD measurement identified that Cu 6 Sn 5 and Ag 3 Sn formed after reflowing for lmin, and as the reflow time extended the quantity of Ag 3 Sn almost remained the same while the quantity of Cu 6 Sn 5 increased. No Cu 3 Sn was detected, even after reflowing for 20min. EDX analysis was consistent with the XRD result.</abstract><pub>IEEE</pub><doi>10.1109/ICEPT.2011.6066855</doi><tpages>5</tpages></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | ISBN: 1457717700 |
| ispartof | 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, 2011, p.1-5 |
| issn | |
| language | eng |
| recordid | cdi_ieee_primary_6066855 |
| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Copper Metallization Microstructure Packaging Silver Tin X-ray scattering |
| title | The evolution of interfacial microstructure of Sn3.5Ag solder bump with Cu under-bump metallization |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-28T21%3A12%3A41IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=The%20evolution%20of%20interfacial%20microstructure%20of%20Sn3.5Ag%20solder%20bump%20with%20Cu%20under-bump%20metallization&rft.btitle=2011%2012th%20International%20Conference%20on%20Electronic%20Packaging%20Technology%20and%20High%20Density%20Packaging&rft.au=Jinglin%20Bi&rft.date=2011-08&rft.spage=1&rft.epage=5&rft.pages=1-5&rft.isbn=1457717700&rft.isbn_list=9781457717703&rft_id=info:doi/10.1109/ICEPT.2011.6066855&rft_dat=%3Cieee_6IE%3E6066855%3C/ieee_6IE%3E%3Curl%3E%3C/url%3E&rft.eisbn=9781457717697&rft.eisbn_list=1457717697&rft.eisbn_list=1457717689&rft.eisbn_list=9781457717680&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=6066855&rfr_iscdi=true |