Novel solvent bonded low cost pigtailed PIN module

In order to lower the cost of optoelectronic packaging, a novel solvent bonding technique has been developed to bond two thermoplastic surfaces, permanently, with a room-temperature cure of approximately 30 seconds. This technique has been applied to a pigtailed PIN module with a canted fiber. A mod...

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Bibliographische Detailangaben

Hauptverfasser:	Ching-Long Jiang, O'Neill, S., Mak, E., Reysen, B.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Assembly Bonding Costs Curing Optical feedback Optical fibers Optical receivers Optical reflection Optical transmitters Solvents
Online-Zugang:	Volltext bestellen
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