Novel solvent bonded low cost pigtailed PIN module

Novel solvent bonded low cost pigtailed PIN module

In order to lower the cost of optoelectronic packaging, a novel solvent bonding technique has been developed to bond two thermoplastic surfaces, permanently, with a room-temperature cure of approximately 30 seconds. This technique has been applied to a pigtailed PIN module with a canted fiber. A mod...

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Hauptverfasser: Ching-Long Jiang, O'Neill, S., Mak, E., Reysen, B.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Assembly
Bonding
Costs
Curing
Optical feedback
Optical fibers
Optical receivers
Optical reflection
Optical transmitters
Solvents
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creator Ching-Long Jiang
O'Neill, S.
Mak, E.
Reysen, B.
description In order to lower the cost of optoelectronic packaging, a novel solvent bonding technique has been developed to bond two thermoplastic surfaces, permanently, with a room-temperature cure of approximately 30 seconds. This technique has been applied to a pigtailed PIN module with a canted fiber. A model has been developed as a design tool to simulate the responsivity and the optical back reflection of various configurations of different angled fibers and canted angles with respect to the PIN detector. Close agreement between simulations and measurements of responsivity and optical back reflection has been achieved. With this design tool, a low cost pigtailed PIN module utilizing a novel solvent bonding technique has been developed to meet CATV applications.
doi_str_mv 10.1109/ECTC.1997.606131
format Conference Proceeding
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source IEEE Electronic Library (IEL) Conference Proceedings
subjects Assembly
Bonding
Costs
Curing
Optical feedback
Optical fibers
Optical receivers
Optical reflection
Optical transmitters
Solvents
title Novel solvent bonded low cost pigtailed PIN module
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