Regression methods for prediction of PECVD Silicon Nitride layer thickness

Different approaches for the prediction of average Silicon Nitride cap layer thickness for the Plasma Enhanced Chemical Vapor Deposition (PECVD) dual-layer metal passivation stack process are compared, based on metrology and production equipment Fault Detection and Classification (FDC) data. Various...

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Bibliographische Detailangaben

Hauptverfasser:	Purwins, H., Nagi, A., Barak, B., Hockele, U., Kyek, A., Lenz, B., Pfeifer, G., Weinzierl, K.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Context Linear regression Predictive models Process control Production Silicon Thickness measurement
Online-Zugang:	Volltext bestellen
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