Using PCA to model shape for process control

Before surface mount components can be placed on a circuit board, it is necessary to print solder paste onto pads. The paste is then melted to make an electrical connection (reflow). A screen printing process is used to print the solder paste onto the board. This is a complicated process with a larg...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Crida, R.C., Stoddart, A.J., Illingworth, J.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Humidity Inspection Principal component analysis Printing machinery Process control Shape control Shape measurement Signal processing Speech processing Temperature
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!