Analysis on thermal reliability of key electronic components on PCB board

Electronic equipment develop continuously toward light, thin, small miniaturization trend. With the increased integration of electronic components, and its increasingly high heat density, small size, compact layout, leading to high temperature of electronic components, greatly reducing the service l...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Shaoting Xu, Xunbo Li
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Electronic components FEM Finite element methods Heating Layout optimal designing PCB board Reliability Temperature distribution temperature field Thermal analysis
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