24-Element Antenna-in-Package for Stationary 60-GHz Communication Scenarios
An integrated multilayer antenna-in-package (AiP) targeted for stationary 60-GHz communication is presented. The key differences in design conditions for mass-market-level and prototype-level AiP are discussed and reflected during the design process. Hence, a low-cost and high-reliability package so...
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| Veröffentlicht in: | IEEE antennas and wireless propagation letters 2011, Vol.10, p.738-741 |
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| container_end_page | 741 |
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| container_title | IEEE antennas and wireless propagation letters |
| container_volume | 10 |
| creator | Wonbin Hong Goudelev, A. Baek, K. Arkhipenkov, V. Juhyung Lee |
| description | An integrated multilayer antenna-in-package (AiP) targeted for stationary 60-GHz communication is presented. The key differences in design conditions for mass-market-level and prototype-level AiP are discussed and reflected during the design process. Hence, a low-cost and high-reliability package solution is realized. The proposed AiP consists of a 4 × 6 array of 24 stacked circular patch antennas and corresponding antenna feed lines designed for phased array. The finalized LTCC AiP prototype features 20 × 15 × 1.02 mm 3 in dimension. Solder bump flip-chip technology is used to attach the AiP to the RFIC for system-level assembly. The assembled package is evaluated using a custom-designed near-field measurement setup. EM simulations and measurements confirm the presented AiP features more than 9 GHz bandwidth, 45° beam-steering ranges in both E- and H-planes, and more than 14.5 dBi gain at boresight. |
| doi_str_mv | 10.1109/LAWP.2011.2162640 |
| format | Article |
| fullrecord | <record><control><sourceid>crossref_RIE</sourceid><recordid>TN_cdi_ieee_primary_5959182</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>5959182</ieee_id><sourcerecordid>10_1109_LAWP_2011_2162640</sourcerecordid><originalsourceid>FETCH-LOGICAL-c265t-7f548e1c40222649a5bf784e565827a226f2de0f0fa6906774d76f7c858c07f3</originalsourceid><addsrcrecordid>eNo9kN1Kw0AQhRdRsFYfQLzJC2yc2WR_chlKbcWAhRa8DOt2VlabjSTxQp_exBavZjhnznD4GLtFSBGhuK_Kl00qADEVqITK4YzNUOaGSy31-bRniqMQ8pJd9f07AGolsxl7EjlfHqihOCRlHChGy0PkG-s-7Bslvu2S7WCH0EbbfScK-Gr9kyzapvmKwf3pydbRaIa2v2YX3h56ujnNOds9LHeLNa-eV4-LsuJOKDlw7cdehC4HIcamhZWvXpucpJJGaDtqXuwJPHirClBa53utvHZGGgfaZ3OGx7eua_u-I19_dqEZ69UI9QSjnmDUE4z6BGPM3B0zgYj-72UhCzQi-wUNy1mb</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype></control><display><type>article</type><title>24-Element Antenna-in-Package for Stationary 60-GHz Communication Scenarios</title><source>IEEE Electronic Library (IEL)</source><creator>Wonbin Hong ; Goudelev, A. ; Baek, K. ; Arkhipenkov, V. ; Juhyung Lee</creator><creatorcontrib>Wonbin Hong ; Goudelev, A. ; Baek, K. ; Arkhipenkov, V. ; Juhyung Lee</creatorcontrib><description>An integrated multilayer antenna-in-package (AiP) targeted for stationary 60-GHz communication is presented. The key differences in design conditions for mass-market-level and prototype-level AiP are discussed and reflected during the design process. Hence, a low-cost and high-reliability package solution is realized. The proposed AiP consists of a 4 × 6 array of 24 stacked circular patch antennas and corresponding antenna feed lines designed for phased array. The finalized LTCC AiP prototype features 20 × 15 × 1.02 mm 3 in dimension. Solder bump flip-chip technology is used to attach the AiP to the RFIC for system-level assembly. The assembled package is evaluated using a custom-designed near-field measurement setup. EM simulations and measurements confirm the presented AiP features more than 9 GHz bandwidth, 45° beam-steering ranges in both E- and H-planes, and more than 14.5 dBi gain at boresight.</description><identifier>ISSN: 1536-1225</identifier><identifier>EISSN: 1548-5757</identifier><identifier>DOI: 10.1109/LAWP.2011.2162640</identifier><identifier>CODEN: IAWPA7</identifier><language>eng</language><publisher>IEEE</publisher><subject>Analog beamforming ; Antenna feeds ; Antenna measurements ; antenna-in-package (AiP) ; Arrays ; low-temperature co-fired ceramics (LTCC) ; millimeter-wave ; patch antenna ; Patch antennas ; Phase measurement</subject><ispartof>IEEE antennas and wireless propagation letters, 2011, Vol.10, p.738-741</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c265t-7f548e1c40222649a5bf784e565827a226f2de0f0fa6906774d76f7c858c07f3</citedby><cites>FETCH-LOGICAL-c265t-7f548e1c40222649a5bf784e565827a226f2de0f0fa6906774d76f7c858c07f3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/5959182$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,776,780,792,4009,27902,27903,27904,54736</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/5959182$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Wonbin Hong</creatorcontrib><creatorcontrib>Goudelev, A.</creatorcontrib><creatorcontrib>Baek, K.</creatorcontrib><creatorcontrib>Arkhipenkov, V.</creatorcontrib><creatorcontrib>Juhyung Lee</creatorcontrib><title>24-Element Antenna-in-Package for Stationary 60-GHz Communication Scenarios</title><title>IEEE antennas and wireless propagation letters</title><addtitle>LAWP</addtitle><description>An integrated multilayer antenna-in-package (AiP) targeted for stationary 60-GHz communication is presented. The key differences in design conditions for mass-market-level and prototype-level AiP are discussed and reflected during the design process. Hence, a low-cost and high-reliability package solution is realized. The proposed AiP consists of a 4 × 6 array of 24 stacked circular patch antennas and corresponding antenna feed lines designed for phased array. The finalized LTCC AiP prototype features 20 × 15 × 1.02 mm 3 in dimension. Solder bump flip-chip technology is used to attach the AiP to the RFIC for system-level assembly. The assembled package is evaluated using a custom-designed near-field measurement setup. EM simulations and measurements confirm the presented AiP features more than 9 GHz bandwidth, 45° beam-steering ranges in both E- and H-planes, and more than 14.5 dBi gain at boresight.</description><subject>Analog beamforming</subject><subject>Antenna feeds</subject><subject>Antenna measurements</subject><subject>antenna-in-package (AiP)</subject><subject>Arrays</subject><subject>low-temperature co-fired ceramics (LTCC)</subject><subject>millimeter-wave</subject><subject>patch antenna</subject><subject>Patch antennas</subject><subject>Phase measurement</subject><issn>1536-1225</issn><issn>1548-5757</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2011</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNo9kN1Kw0AQhRdRsFYfQLzJC2yc2WR_chlKbcWAhRa8DOt2VlabjSTxQp_exBavZjhnznD4GLtFSBGhuK_Kl00qADEVqITK4YzNUOaGSy31-bRniqMQ8pJd9f07AGolsxl7EjlfHqihOCRlHChGy0PkG-s-7Bslvu2S7WCH0EbbfScK-Gr9kyzapvmKwf3pydbRaIa2v2YX3h56ujnNOds9LHeLNa-eV4-LsuJOKDlw7cdehC4HIcamhZWvXpucpJJGaDtqXuwJPHirClBa53utvHZGGgfaZ3OGx7eua_u-I19_dqEZ69UI9QSjnmDUE4z6BGPM3B0zgYj-72UhCzQi-wUNy1mb</recordid><startdate>2011</startdate><enddate>2011</enddate><creator>Wonbin Hong</creator><creator>Goudelev, A.</creator><creator>Baek, K.</creator><creator>Arkhipenkov, V.</creator><creator>Juhyung Lee</creator><general>IEEE</general><scope>97E</scope><scope>RIA</scope><scope>RIE</scope><scope>AAYXX</scope><scope>CITATION</scope></search><sort><creationdate>2011</creationdate><title>24-Element Antenna-in-Package for Stationary 60-GHz Communication Scenarios</title><author>Wonbin Hong ; Goudelev, A. ; Baek, K. ; Arkhipenkov, V. ; Juhyung Lee</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c265t-7f548e1c40222649a5bf784e565827a226f2de0f0fa6906774d76f7c858c07f3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2011</creationdate><topic>Analog beamforming</topic><topic>Antenna feeds</topic><topic>Antenna measurements</topic><topic>antenna-in-package (AiP)</topic><topic>Arrays</topic><topic>low-temperature co-fired ceramics (LTCC)</topic><topic>millimeter-wave</topic><topic>patch antenna</topic><topic>Patch antennas</topic><topic>Phase measurement</topic><toplevel>online_resources</toplevel><creatorcontrib>Wonbin Hong</creatorcontrib><creatorcontrib>Goudelev, A.</creatorcontrib><creatorcontrib>Baek, K.</creatorcontrib><creatorcontrib>Arkhipenkov, V.</creatorcontrib><creatorcontrib>Juhyung Lee</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 2005-present</collection><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>CrossRef</collection><jtitle>IEEE antennas and wireless propagation letters</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Wonbin Hong</au><au>Goudelev, A.</au><au>Baek, K.</au><au>Arkhipenkov, V.</au><au>Juhyung Lee</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>24-Element Antenna-in-Package for Stationary 60-GHz Communication Scenarios</atitle><jtitle>IEEE antennas and wireless propagation letters</jtitle><stitle>LAWP</stitle><date>2011</date><risdate>2011</risdate><volume>10</volume><spage>738</spage><epage>741</epage><pages>738-741</pages><issn>1536-1225</issn><eissn>1548-5757</eissn><coden>IAWPA7</coden><abstract>An integrated multilayer antenna-in-package (AiP) targeted for stationary 60-GHz communication is presented. The key differences in design conditions for mass-market-level and prototype-level AiP are discussed and reflected during the design process. Hence, a low-cost and high-reliability package solution is realized. The proposed AiP consists of a 4 × 6 array of 24 stacked circular patch antennas and corresponding antenna feed lines designed for phased array. The finalized LTCC AiP prototype features 20 × 15 × 1.02 mm 3 in dimension. Solder bump flip-chip technology is used to attach the AiP to the RFIC for system-level assembly. The assembled package is evaluated using a custom-designed near-field measurement setup. EM simulations and measurements confirm the presented AiP features more than 9 GHz bandwidth, 45° beam-steering ranges in both E- and H-planes, and more than 14.5 dBi gain at boresight.</abstract><pub>IEEE</pub><doi>10.1109/LAWP.2011.2162640</doi><tpages>4</tpages></addata></record> |
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| ispartof | IEEE antennas and wireless propagation letters, 2011, Vol.10, p.738-741 |
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| subjects | Analog beamforming Antenna feeds Antenna measurements antenna-in-package (AiP) Arrays low-temperature co-fired ceramics (LTCC) millimeter-wave patch antenna Patch antennas Phase measurement |
| title | 24-Element Antenna-in-Package for Stationary 60-GHz Communication Scenarios |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-25T00%3A21%3A14IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-crossref_RIE&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=24-Element%20Antenna-in-Package%20for%20Stationary%2060-GHz%20Communication%20Scenarios&rft.jtitle=IEEE%20antennas%20and%20wireless%20propagation%20letters&rft.au=Wonbin%20Hong&rft.date=2011&rft.volume=10&rft.spage=738&rft.epage=741&rft.pages=738-741&rft.issn=1536-1225&rft.eissn=1548-5757&rft.coden=IAWPA7&rft_id=info:doi/10.1109/LAWP.2011.2162640&rft_dat=%3Ccrossref_RIE%3E10_1109_LAWP_2011_2162640%3C/crossref_RIE%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=5959182&rfr_iscdi=true |