Temperature-dependent reverse leakage current characterization of n-GaN Schottky diodes

n-GaN Schottky barrier diodes were fabricated on a sapphire substrate. Ni/Au and Ti/Al/Mo/Au were used for Schottky and ohmic contacts, respectively. A better fitted characteristic was obtained by calculation of thermionic-field emission. Similar comparison was made for current-voltage characteristi...

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Hauptverfasser: Saito, T., Nitanda, K., Syahiman, A., Tokuda, H., Kuzuhara, M.
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Nitanda, K.
Syahiman, A.
Tokuda, H.
Kuzuhara, M.
description n-GaN Schottky barrier diodes were fabricated on a sapphire substrate. Ni/Au and Ti/Al/Mo/Au were used for Schottky and ohmic contacts, respectively. A better fitted characteristic was obtained by calculation of thermionic-field emission. Similar comparison was made for current-voltage characteristics measured at high temperatures up to 523 K. With the increase in the device temperature, better fitting was obtained with a thermionic emission theory.
doi_str_mv 10.1109/IMFEDK.2011.5944854
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subjects Current measurement
GaN
Plasma temperature
Schottky barrier diodes
Schottky barriers
Schottky diodes
Temperature
Temperature measurement
thermionic-field emission
Voltage measurement
title Temperature-dependent reverse leakage current characterization of n-GaN Schottky diodes
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