A novel methodology for architecture-level exploration of 3D SoCs

Three-dimensional (3D) integration is an emerging technology that is expected to lead to tremendous benefits in terms of power, delay and silicon area. Moreover, 3D technology continues interconnect advances beyond the CMOS scaling predicted by Moore's Law, which enable new capabilities not ava...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Diamantopoulos, D., Siozios, K., Bekiaris, D., Soudris, D.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	3D IC CAD Tools Computer architecture Delay IP networks Methodology Physical Design Routing Solid modeling System-on-a-chip Three dimensional displays
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