A materials database for microwave packaging design
A joint services project to develop a microwave materials database is described. The major goal is to improve the availability of accurate data on the "high tech materials" needed for cost-effective production of microwave packages.
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| creator | Harris, H.M. Rucker, C.T. Farley, J.R. |
| description | A joint services project to develop a microwave materials database is described. The major goal is to improve the availability of accurate data on the "high tech materials" needed for cost-effective production of microwave packages. |
| doi_str_mv | 10.1109/EPEP.1994.594122 |
| format | Conference Proceeding |
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The major goal is to improve the availability of accurate data on the "high tech materials" needed for cost-effective production of microwave packages.</description><identifier>ISBN: 0780324110</identifier><identifier>ISBN: 9780780324114</identifier><identifier>DOI: 10.1109/EPEP.1994.594122</identifier><language>eng</language><publisher>IEEE</publisher><subject>Aerospace materials ; Assembly ; Electromagnetic heating ; Electronics packaging ; Integrated circuit packaging ; Semiconductor device packaging ; Temperature ; Thermal conductivity ; Thermal expansion</subject><ispartof>Proceedings of 1994 IEEE Electrical Performance of Electronic Packaging, 1994, p.151-153</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/594122$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,776,780,785,786,2052,4036,4037,27902,54895</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/594122$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Harris, H.M.</creatorcontrib><creatorcontrib>Rucker, C.T.</creatorcontrib><creatorcontrib>Farley, J.R.</creatorcontrib><title>A materials database for microwave packaging design</title><title>Proceedings of 1994 IEEE Electrical Performance of Electronic Packaging</title><addtitle>EPEP</addtitle><description>A joint services project to develop a microwave materials database is described. The major goal is to improve the availability of accurate data on the "high tech materials" needed for cost-effective production of microwave packages.</description><subject>Aerospace materials</subject><subject>Assembly</subject><subject>Electromagnetic heating</subject><subject>Electronics packaging</subject><subject>Integrated circuit packaging</subject><subject>Semiconductor device packaging</subject><subject>Temperature</subject><subject>Thermal conductivity</subject><subject>Thermal expansion</subject><isbn>0780324110</isbn><isbn>9780780324114</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>1994</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNpjYJAwNNAzNDSw1HcNcA3QM7S0NNEztTQxNDJiZuAyMLcwMDYyAUpzMPAWF2cZAIGJqSlQlpPB2FEhN7EktSgzMadYISWxJDEpsThVIS2_SCE3M7kovzyxLFWhIDE5OzE9My9dISW1ODM9j4eBNQ2oPJUXSnMzSLm5hjh76GampqbGFxRl5iYWVcZDrDfGKwkA_OkzNw</recordid><startdate>1994</startdate><enddate>1994</enddate><creator>Harris, H.M.</creator><creator>Rucker, C.T.</creator><creator>Farley, J.R.</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>1994</creationdate><title>A materials database for microwave packaging design</title><author>Harris, H.M. ; Rucker, C.T. ; Farley, J.R.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-ieee_primary_5941223</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>1994</creationdate><topic>Aerospace materials</topic><topic>Assembly</topic><topic>Electromagnetic heating</topic><topic>Electronics packaging</topic><topic>Integrated circuit packaging</topic><topic>Semiconductor device packaging</topic><topic>Temperature</topic><topic>Thermal conductivity</topic><topic>Thermal expansion</topic><toplevel>online_resources</toplevel><creatorcontrib>Harris, H.M.</creatorcontrib><creatorcontrib>Rucker, C.T.</creatorcontrib><creatorcontrib>Farley, J.R.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Harris, H.M.</au><au>Rucker, C.T.</au><au>Farley, J.R.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>A materials database for microwave packaging design</atitle><btitle>Proceedings of 1994 IEEE Electrical Performance of Electronic Packaging</btitle><stitle>EPEP</stitle><date>1994</date><risdate>1994</risdate><spage>151</spage><epage>153</epage><pages>151-153</pages><isbn>0780324110</isbn><isbn>9780780324114</isbn><abstract>A joint services project to develop a microwave materials database is described. The major goal is to improve the availability of accurate data on the "high tech materials" needed for cost-effective production of microwave packages.</abstract><pub>IEEE</pub><doi>10.1109/EPEP.1994.594122</doi></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | ISBN: 0780324110 |
| ispartof | Proceedings of 1994 IEEE Electrical Performance of Electronic Packaging, 1994, p.151-153 |
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| language | eng |
| recordid | cdi_ieee_primary_594122 |
| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Aerospace materials Assembly Electromagnetic heating Electronics packaging Integrated circuit packaging Semiconductor device packaging Temperature Thermal conductivity Thermal expansion |
| title | A materials database for microwave packaging design |
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