A 16-Mbit DRAM with a relaxed sense-amplifier-pitch open-bit-line architecture

A 16-Mb dynamic RAM has been designed and fabricated using 0.5- mu m CMOS technology with double-level metallization. It uses a novel trench-type surrounding high-capacitance cell (SCC) that measures only 3.3- mu m/sup 2/ in cell size with a 63-fF storage capacitance. A novel relaxed sense-amplifier...

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Veröffentlicht in:IEEE journal of solid-state circuits 1988-10, Vol.23 (5), p.1104-1112
Hauptverfasser: Inoue, M., Yamada, T., Kotani, H., Yamauchi, H., Fujiwara, A., Matsushima, J., Akamatsu, H., Fukumoto, M., Kubota, M., Nakao, I., Aoi, N., Fuse, G., Ogawa, S., Odanaka, S., Ueno, A., Yamamoto, H.
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Sprache:eng
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Zusammenfassung:A 16-Mb dynamic RAM has been designed and fabricated using 0.5- mu m CMOS technology with double-level metallization. It uses a novel trench-type surrounding high-capacitance cell (SCC) that measures only 3.3- mu m/sup 2/ in cell size with a 63-fF storage capacitance. A novel relaxed sense-amplifier-pitch (RSAP) open-bit-line architecture used on the DRAM achieves a high-density memory cell array, while maintaining a large enough layout pitch for the sense amplifier. These concepts allow the small chip that measures 5.4*17.38 (93.85) mm/sup 2/ to be mounted in a 300-mil dual-in-line package with 65-ns RAS access time and 35-ns column address access time.< >
ISSN:0018-9200
1558-173X
DOI:10.1109/4.5931