A 16-Mbit DRAM with a relaxed sense-amplifier-pitch open-bit-line architecture
A 16-Mb dynamic RAM has been designed and fabricated using 0.5- mu m CMOS technology with double-level metallization. It uses a novel trench-type surrounding high-capacitance cell (SCC) that measures only 3.3- mu m/sup 2/ in cell size with a 63-fF storage capacitance. A novel relaxed sense-amplifier...
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Veröffentlicht in: | IEEE journal of solid-state circuits 1988-10, Vol.23 (5), p.1104-1112 |
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Sprache: | eng |
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Zusammenfassung: | A 16-Mb dynamic RAM has been designed and fabricated using 0.5- mu m CMOS technology with double-level metallization. It uses a novel trench-type surrounding high-capacitance cell (SCC) that measures only 3.3- mu m/sup 2/ in cell size with a 63-fF storage capacitance. A novel relaxed sense-amplifier-pitch (RSAP) open-bit-line architecture used on the DRAM achieves a high-density memory cell array, while maintaining a large enough layout pitch for the sense amplifier. These concepts allow the small chip that measures 5.4*17.38 (93.85) mm/sup 2/ to be mounted in a 300-mil dual-in-line package with 65-ns RAS access time and 35-ns column address access time.< > |
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ISSN: | 0018-9200 1558-173X |
DOI: | 10.1109/4.5931 |