Formation of through aluminum via for noble metal PCB and packaging substrate

Aluminum oxide provides high impedance insulation layer on the surface of the aluminum (alloy) body and many 1-dimensional PCBs or module arrays based upon aluminum anodization have been proposed. However 3-dimensional packages or modules can hardly be found. This mismatch is because reliable vertic...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Jung Kyu Park, Young Ki Lee, Seung Hwan Choi, Sang Hyun Shin, Myoung Soo Choi
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Aluminum Insulation Light emitting diodes Substrates Surface treatment
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!