Recrystallization behavior of lead free and lead containing solder in cycling

The present work addresses the effects of thermomechanical history on the recrystallization behavior of lead free and backward compatible solder joints. 30 mil SAC305 balls were reflowed onto BGA pads using either a SAC305 or a eutectic SnPb paste. Systematic variations of the rate of recrystallizat...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Qasaimeh, A., Jaradat, Y., Wentlent, L., Yang, L., Liang Yin, Arfaei, B., Borgesen, P.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Aging Annealing Joints Lead Soldering
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