Green manufacturing process for solder-less PCB assembly using uniform pressure surface interconnector and anisotropic conductive film

A new printed circuit board assembly (PBA) manufacturing process was invented and applied to replace conventional solder interconnection. For the realization of the new process, an unique equipment, uniform pressure surface interconnector (UPSI), was designed and fabricated. The new manufacturing me...

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Bibliographische Detailangaben

Hauptverfasser:	Kyung-Woon Jang, Chang-Kyu Chung, Jiyoung Jang, Soon-Min Hong, Min-Young Park, Youngjun Moon, Seungbae Park
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Adhesives Contact resistance Flip chip Manufacturing processes Resistors Rubber Surface treatment
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