Electromigration studies of lead-free solder balls used for wafer-level packaging

Electromigration experiments have been conducted on lead-free solder balls in wafer-level packages (WLP). Lifetime distribution, Joule heating, failure mode, and the effect of current-direction are discussed. In addition, these results are compared with similar BGA interconnects in packages surface-...

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Bibliographische Detailangaben

Hauptverfasser:	Hau-Riege, Christine, Zang, Ricky, You-Wen Yau, Yadav, Praveen, Keser, Beth, Jong-Kai Lin
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Copper Current density Electromigration Heating Integrated circuit interconnections Nickel Reliability
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