Electromigration studies of lead-free solder balls used for wafer-level packaging

Electromigration studies of lead-free solder balls used for wafer-level packaging

Electromigration experiments have been conducted on lead-free solder balls in wafer-level packages (WLP). Lifetime distribution, Joule heating, failure mode, and the effect of current-direction are discussed. In addition, these results are compared with similar BGA interconnects in packages surface-...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Hau-Riege, Christine, Zang, Ricky, You-Wen Yau, Yadav, Praveen, Keser, Beth, Jong-Kai Lin
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Copper
Current density
Electromigration
Heating
Integrated circuit interconnections
Nickel
Reliability
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page 721
container_issue
container_start_page 717
container_title
container_volume
creator Hau-Riege, Christine
Zang, Ricky
You-Wen Yau
Yadav, Praveen
Keser, Beth
Jong-Kai Lin
description Electromigration experiments have been conducted on lead-free solder balls in wafer-level packages (WLP). Lifetime distribution, Joule heating, failure mode, and the effect of current-direction are discussed. In addition, these results are compared with similar BGA interconnects in packages surface-mounted to boards as well as lead-free flip-chip bumps. It is concluded that the interconnects of this study are robust for electromigration reliability owing to its under bump metallurgy (UBM) and size.
doi_str_mv 10.1109/ECTC.2011.5898592
format Conference Proceeding
fullrecord <record><control><sourceid>ieee_6IE</sourceid><recordid>TN_cdi_ieee_primary_5898592</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>5898592</ieee_id><sourcerecordid>5898592</sourcerecordid><originalsourceid>FETCH-LOGICAL-i175t-2a09cd93528ea66fd8230574d7357c7dfb005e7b9db1c9ebc6019716960a82723</originalsourceid><addsrcrecordid>eNpFkMtKAzEYRuMNbKsPIG7yAql_ksltKUO9QEGEui6ZyZ8STTslmSq-vYIFV9_iwIHzEXLDYc45uLtFu2rnAjifK-uscuKETLnmwjaN03BKJkIaw5QR-uwfGHdOJqC0Y0qBvCTTWt8BGgBuJ-R1kbEfy7BNm-LHNOxoHQ8hYaVDpBl9YLEg0jrkgIV2PudKDxUDjUOhXz5iYRk_MdO97z_8Ju02V-Qi-lzx-rgz8vawWLVPbPny-NzeL1niRo1MeHB9cFIJi17rGKyQoEwTjFSmNyF2AApN50LHe4ddr4E7w_Vvp7fCCDkjt3_ehIjrfUlbX77Xx1_kD_CPUuM</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>Electromigration studies of lead-free solder balls used for wafer-level packaging</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Hau-Riege, Christine ; Zang, Ricky ; You-Wen Yau ; Yadav, Praveen ; Keser, Beth ; Jong-Kai Lin</creator><creatorcontrib>Hau-Riege, Christine ; Zang, Ricky ; You-Wen Yau ; Yadav, Praveen ; Keser, Beth ; Jong-Kai Lin</creatorcontrib><description>Electromigration experiments have been conducted on lead-free solder balls in wafer-level packages (WLP). Lifetime distribution, Joule heating, failure mode, and the effect of current-direction are discussed. In addition, these results are compared with similar BGA interconnects in packages surface-mounted to boards as well as lead-free flip-chip bumps. It is concluded that the interconnects of this study are robust for electromigration reliability owing to its under bump metallurgy (UBM) and size.</description><identifier>ISSN: 0569-5503</identifier><identifier>ISBN: 1612844979</identifier><identifier>ISBN: 9781612844978</identifier><identifier>EISSN: 2377-5726</identifier><identifier>EISBN: 1612844960</identifier><identifier>EISBN: 1612844987</identifier><identifier>EISBN: 9781612844961</identifier><identifier>EISBN: 9781612844985</identifier><identifier>DOI: 10.1109/ECTC.2011.5898592</identifier><language>eng</language><publisher>IEEE</publisher><subject>Copper ; Current density ; Electromigration ; Heating ; Integrated circuit interconnections ; Nickel ; Reliability</subject><ispartof>2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 2011, p.717-721</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/5898592$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,780,784,789,790,2058,27925,54920</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/5898592$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Hau-Riege, Christine</creatorcontrib><creatorcontrib>Zang, Ricky</creatorcontrib><creatorcontrib>You-Wen Yau</creatorcontrib><creatorcontrib>Yadav, Praveen</creatorcontrib><creatorcontrib>Keser, Beth</creatorcontrib><creatorcontrib>Jong-Kai Lin</creatorcontrib><title>Electromigration studies of lead-free solder balls used for wafer-level packaging</title><title>2011 IEEE 61st Electronic Components and Technology Conference (ECTC)</title><addtitle>ECTC</addtitle><description>Electromigration experiments have been conducted on lead-free solder balls in wafer-level packages (WLP). Lifetime distribution, Joule heating, failure mode, and the effect of current-direction are discussed. In addition, these results are compared with similar BGA interconnects in packages surface-mounted to boards as well as lead-free flip-chip bumps. It is concluded that the interconnects of this study are robust for electromigration reliability owing to its under bump metallurgy (UBM) and size.</description><subject>Copper</subject><subject>Current density</subject><subject>Electromigration</subject><subject>Heating</subject><subject>Integrated circuit interconnections</subject><subject>Nickel</subject><subject>Reliability</subject><issn>0569-5503</issn><issn>2377-5726</issn><isbn>1612844979</isbn><isbn>9781612844978</isbn><isbn>1612844960</isbn><isbn>1612844987</isbn><isbn>9781612844961</isbn><isbn>9781612844985</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2011</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNpFkMtKAzEYRuMNbKsPIG7yAql_ksltKUO9QEGEui6ZyZ8STTslmSq-vYIFV9_iwIHzEXLDYc45uLtFu2rnAjifK-uscuKETLnmwjaN03BKJkIaw5QR-uwfGHdOJqC0Y0qBvCTTWt8BGgBuJ-R1kbEfy7BNm-LHNOxoHQ8hYaVDpBl9YLEg0jrkgIV2PudKDxUDjUOhXz5iYRk_MdO97z_8Ju02V-Qi-lzx-rgz8vawWLVPbPny-NzeL1niRo1MeHB9cFIJi17rGKyQoEwTjFSmNyF2AApN50LHe4ddr4E7w_Vvp7fCCDkjt3_ehIjrfUlbX77Xx1_kD_CPUuM</recordid><startdate>201105</startdate><enddate>201105</enddate><creator>Hau-Riege, Christine</creator><creator>Zang, Ricky</creator><creator>You-Wen Yau</creator><creator>Yadav, Praveen</creator><creator>Keser, Beth</creator><creator>Jong-Kai Lin</creator><general>IEEE</general><scope>6IE</scope><scope>6IH</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIO</scope></search><sort><creationdate>201105</creationdate><title>Electromigration studies of lead-free solder balls used for wafer-level packaging</title><author>Hau-Riege, Christine ; Zang, Ricky ; You-Wen Yau ; Yadav, Praveen ; Keser, Beth ; Jong-Kai Lin</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i175t-2a09cd93528ea66fd8230574d7357c7dfb005e7b9db1c9ebc6019716960a82723</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2011</creationdate><topic>Copper</topic><topic>Current density</topic><topic>Electromigration</topic><topic>Heating</topic><topic>Integrated circuit interconnections</topic><topic>Nickel</topic><topic>Reliability</topic><toplevel>online_resources</toplevel><creatorcontrib>Hau-Riege, Christine</creatorcontrib><creatorcontrib>Zang, Ricky</creatorcontrib><creatorcontrib>You-Wen Yau</creatorcontrib><creatorcontrib>Yadav, Praveen</creatorcontrib><creatorcontrib>Keser, Beth</creatorcontrib><creatorcontrib>Jong-Kai Lin</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan (POP) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP) 1998-present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Hau-Riege, Christine</au><au>Zang, Ricky</au><au>You-Wen Yau</au><au>Yadav, Praveen</au><au>Keser, Beth</au><au>Jong-Kai Lin</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Electromigration studies of lead-free solder balls used for wafer-level packaging</atitle><btitle>2011 IEEE 61st Electronic Components and Technology Conference (ECTC)</btitle><stitle>ECTC</stitle><date>2011-05</date><risdate>2011</risdate><spage>717</spage><epage>721</epage><pages>717-721</pages><issn>0569-5503</issn><eissn>2377-5726</eissn><isbn>1612844979</isbn><isbn>9781612844978</isbn><eisbn>1612844960</eisbn><eisbn>1612844987</eisbn><eisbn>9781612844961</eisbn><eisbn>9781612844985</eisbn><abstract>Electromigration experiments have been conducted on lead-free solder balls in wafer-level packages (WLP). Lifetime distribution, Joule heating, failure mode, and the effect of current-direction are discussed. In addition, these results are compared with similar BGA interconnects in packages surface-mounted to boards as well as lead-free flip-chip bumps. It is concluded that the interconnects of this study are robust for electromigration reliability owing to its under bump metallurgy (UBM) and size.</abstract><pub>IEEE</pub><doi>10.1109/ECTC.2011.5898592</doi><tpages>5</tpages></addata></record>
fulltext fulltext_linktorsrc
identifier ISSN: 0569-5503
ispartof 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 2011, p.717-721
issn 0569-5503
2377-5726
language eng
recordid cdi_ieee_primary_5898592
source IEEE Electronic Library (IEL) Conference Proceedings
subjects Copper
Current density
Electromigration
Heating
Integrated circuit interconnections
Nickel
Reliability
title Electromigration studies of lead-free solder balls used for wafer-level packaging
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-04T02%3A30%3A31IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=Electromigration%20studies%20of%20lead-free%20solder%20balls%20used%20for%20wafer-level%20packaging&rft.btitle=2011%20IEEE%2061st%20Electronic%20Components%20and%20Technology%20Conference%20(ECTC)&rft.au=Hau-Riege,%20Christine&rft.date=2011-05&rft.spage=717&rft.epage=721&rft.pages=717-721&rft.issn=0569-5503&rft.eissn=2377-5726&rft.isbn=1612844979&rft.isbn_list=9781612844978&rft_id=info:doi/10.1109/ECTC.2011.5898592&rft_dat=%3Cieee_6IE%3E5898592%3C/ieee_6IE%3E%3Curl%3E%3C/url%3E&rft.eisbn=1612844960&rft.eisbn_list=1612844987&rft.eisbn_list=9781612844961&rft.eisbn_list=9781612844985&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=5898592&rfr_iscdi=true