Design, fabrication and characterization of low-cost glass interposers with fine-pitch through-package-vias

This paper demonstrates thin glass interposers with fine pitch through package vias (TPV) as a low cost and high I/O substrate for 3D integration. Interposers for packaging of ULK and 3D-ICs need to support large numbers of die to die interconnections with I/O pitch below 50 μm. Current organic subs...

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Bibliographische Detailangaben

Hauptverfasser:	Sukumaran, V., Bandyopadhyay, T., Chen, Q., Kumbhat, N., Liu, F., Pucha, R., Sato, Y., Watanabe, M., Kitaoka, K., Ono, M., Suzuki, Y., Karoui, C., Nopper, C., Swaminathan, M., Sundaram, V., Tummala, R.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Copper Electrical design fine line wiring Glass Glass interposer laser ablation mechanical modeling Polymers Stress Substrates through package via Wiring
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