Post etch killer defect characterization and reduction in a self-aligned double patterning technology

This paper identifies post etch killer defects, e.g., core bridging, small particle and tiny bridging, and investigates the possible solutions in a SADP module. Among the killer defect adders, core bridging and small particle are commonly observed after the oxide core removal by BOE. Core bridging a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Hong-Ji Lee, Sun-Yi Lin, I-Ting Lin, Kuo-Liang Wei, Sheng-Yuan Chang, Nan-Tzu Lian, Tahone Yang, Kuang-Chao Chen, Chih-Yuan Lu
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Adders Cleaning defect characterization defect reduction Etching Flash memory Inspection Plasmas Polymers post etch defect SADP yield improvement
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