A novel power system in package with 3D chip on chip interconnections of the power transistor and its gate driver

Currently, most industrial power modules, even IPEMs (Intelligent Power Electronics Modules), are interconnected in a planar way, and interconnections are made with bonding wires. This paper presents a three dimensional interconnection solution based on the idea to flip chip the gate driver directly...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Timothe, S., Nicolas, R., Jean-Christophe, C., Victor, G., Pheng, I.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Assembly Copper Driver circuits Flip chip Gold Logic gates Wires
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