Immersion lithography process improvements by wafer edge inspection at 300mm DRAM manufacturing fab

Edge die yield is becoming critical as semiconductor manufacturing fabs attempt to save costs and reduce wafer edge exclusion to produce more good die per wafer. As a consequence, wafer edge defect inspection and metrology applications are now critical components of the overall yield management stra...

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Bibliographische Detailangaben

Hauptverfasser:	Strobl, M, Hsu, C, Yu Chen Lin, Chen, H, Chen, D, Cheng, A, WonGun Lee, Lin, S, Donzella, O, Leung, R, Kopp, J, Pinto, B
Format:	Tagungsbericht
Sprache:	eng
Online-Zugang:	Volltext bestellen
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