Development of Single Phase Liquid Cooling Solution for 3-D Silicon Modules

Demand for increased functionalities and the trend in product miniaturization have created new challenges for electronic packaging. The move to 3-D packages combines the benefits of small footprint packages and through-silicon-vias technology to overcome the limitations. However, thermal management...

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Veröffentlicht in:	IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2011-04, Vol.1 (4), p.536-544
Hauptverfasser:	Tan, S P, Kok Chuan Toh, Khan, N, Pinjala, D, Kripesh, V
Format:	Artikel
Sprache:	eng
Schlagworte:	3-D packaging Applied sciences Cooling Design. Technologies. Operation analysis. Testing Electronics Exact sciences and technology flow distribution Integrated circuits liquid-cooling Microchannel microchannels Resistance heating Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Silicon Studies thermal Thermal conductivity Thermal resistance
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