Solving eventual bonding quality to enhance adhesion for QFN packages

Many of the components used extensively in today's handheld market are beginning to migrate from traditional lead frame design to leadless or non leaded. The primary driver for handheld manufacturers is the saved PC board space created by these components' smaller mounting areas. In additi...

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Bibliographische Detailangaben

Hauptverfasser:	Kumar, S, Sivarao, S, Cheong, M T, Azmeer, M, Fuaida, H
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Force Heating Inspection Lead Production Robustness Wire
Online-Zugang:	Volltext bestellen
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