Chipping free process for combination of narrow saw street (60um) and thick wafer (600um) sawing process

Chipping free is a dream for wafer sawing process. With current high complexity of wafer technology plus the drive for cost reduction by narrowing the saw street width, it is a challenge which requires huge effort for wafer sawing process to achieve chipping free process. Higher density of metalliza...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Amri, Mohd Syahrin, Liew, David, Harun, Fuaida
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Aluminum Blades chipping/peeling free Diamond-like carbon Laser applications laser grooving Optimization Sawing seal ring
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!