TSV Redundancy: Architecture and Design Issues in 3-D IC

3-D technology provides many benefits including high density, high bandwidth, low-power, and small form-factor. Through Silicon Via (TSV), which provides communication links for dies in vertical direction, is a critical design issue in 3-D integration. Just like other components, the fabrication and...

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Veröffentlicht in:	IEEE transactions on very large scale integration (VLSI) systems 2012-04, Vol.20 (4), p.711-722
Hauptverfasser:	HSIEH, Ang-Chih, HWANG, Tingting
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Architecture Blocking Bonding Computer architecture Defect-tolerance Design engineering Design. Technologies. Operation analysis. Testing Dies Electronics Exact sciences and technology Integrated circuits Receivers Redundancy Redundant reliability Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Testing Three dimensional Through-silicon vias Very large scale integration yield
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