Fabrication of multilayer interconnection materials and bonding film for high integration applications

To meet the demands for increased integration and multi functions for multilayer electronic components the related materials and process technique for layer-to-layer interconnection have to be developed together. Using nano-, micro-sized metal powders and epoxy resins conductive via pastes have been...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Myong-Jae Yoo, Seong-dae Park, Woo Sung Lee, Ha-kin Hwang
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Bonding Conductivity Integrated circuit interconnections Surface treatment Thermal conductivity
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