Multiscale thermal design of MCMs with high resolution unstructured adaptive simulation tools

A novel computational approach, VPE, has been presented for multi-scale analysis of electronics packaging/cooling. The VPE software system has been designed for fully automated model assembly, grid generation based on compact, reusable electronic component database representation, interactive design, and visualization. Advanced thermal analysis code, CFD-ACE, has been developed with unstructured, solution adaptive grid. The paper has demonstrated a novel concept of unstructured solution adaptive grids for high resolution flow and thermal analysis of electronics components and boards. It was demonstrated on detailed 3D heat transfer studies of MCMs and their assemblies. It has also been demonstrated that a high fidellity multi-scale thermal analysis is possible in which 3D air flow/heat transfer is solved simultaneously with detailed heat condition within individual electronics components. At present, the VPE is being extended for fully automatic design starting from the geometry definition up to the visualization step. A thermal stress module is being linked for full thermo-mechanical analysis.