Build-up electrical insulation material with low-dielectric tangent, low-CTE and low-surface roughness

With the increasing speed of information and communications equipment in recent years, together with high-speed signal processing of LSIs, there is a requirement for build-up electrical insulation materials to be used as IC package substrates with low-dielectric tangent, and to reduce the dielectric...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Suzuki, I, Tanaka, T, Uenishi, A, Kobayashi, T, Murakami, J
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Copper Dielectric losses Insulation Propagation losses Substrates
Online-Zugang:	Volltext bestellen
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