1mW 4-5GHz packaged VCO with bonding-to-ground inductors

A packaged VCO, which utilizes the heat-sink pad in Quad Flat Pack No-Lead (QFN) package to provide a ground connection for bonding wire inductors, is presented in this paper. The proposed VCO is designed to cover 4 to 5 GHz band and is able to work under a minimum of 0.9 V DC supply voltage with on...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Congyin Shi, Le Ye, Junhua Liu
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Bonding Frequency measurement Inductance Inductors Silicon Voltage-controlled oscillators Wire
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