Development of a magnetron-enhanced plasma process for tungsten etchback with response-surface methodology

A two-step etchback process to form tungsten plugs in submicron contacts and vias has been developed. the process uses an Applied Materials Inc., P5000 WCVD magnetron-enhanced, single-wafer system with an experimental design and response-surface methodology. Tungsten is first etched with an Ar/SF/su...

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Veröffentlicht in:	IEEE transactions on semiconductor manufacturing 1990-08, Vol.3 (3), p.142-144
Hauptverfasser:	Riley, P.E., Chang, M., Ghanayem, S.G., Mak, A.
Format:	Artikel
Sprache:	eng
Schlagworte:	Argon Etching Magnetic field measurement Magnetic films Magnetic materials Plasma applications Plasma materials processing Plasma measurements Tin Tungsten
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