Investigation on the efficiency of thermal relief shapes on different Printed Circuit Boards

As known, thermal relief is a technique used to separate soldering pads or plated through-hole vias from large copper planes in order to reduce soldering dwell time by providing thermal resistance during the process, thus minimizing the heat transfer to the plane. However, during normal operation, t...

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Bibliographische Detailangaben

Hauptverfasser:	Plotog, I, Varzaru, G, Bunea, R, Busu, I, Cucu, T, Svasta, P
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Copper heat transfer reflow Reflow soldering Temperature measurement Thermal conductivity thermal relief Thermal resistance
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